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U.S.-Japan Semiconductor Agreement Data Collection Program Report
U.S.-Japan Semiconductor Agreement Data Collection Program Report
OMB: 0625-0211
IC ID: 3846
OMB.report
DOC/ITA
OMB 0625-0211
ICR 199903-0625-001
IC 3846
( )
⚠️ Notice: This information collection may be referencing outdated material. More recent filings for OMB 0625-0211 can be found here:
2004-02-23 - No material or nonsubstantive change to a currently approved collection
2002-05-30 - Extension without change of a currently approved collection
Documents and Forms
Document Name
Document Type
no available documents/forms check other ICs listed under this ICR
Information Collection (IC) Details
View Information Collection (IC)
IC Title:
U.S.-Japan Semiconductor Agreement Data Collection Program Report
Agency IC Tracking Number:
Is this a Common Form?
No
IC Status:
Migrated
Obligation to Respond:
Voluntary
CFR Citation:
Information Collection Instruments:
Document Type
Form No.
Form Name
Instrument File
URL
Available Electronically?
Can Be Submitted Electronically?
Electronic Capability
Form
ITA-4115P
No
No
Federal Enterprise Architecture Business Reference Module
Line of Business:
Subfunction:
Privacy Act System of Records
Title:
FR Citation:
Number of Respondents:
32
Number of Respondents for Small Entity:
0
Affected Public:
Private Sector
Private Sector:
Businesses or other for-profits
Percentage of Respondents Reporting Electronically:
0 %
Approved
Program Change Due to New Statute
Program Change Due to Agency Discretion
Change Due to Adjustment in Agency Estimate
Change Due to Potential Violation of the PRA
Previously Approved
Annual Number of Responses for this IC
384
0
384
0
0
0
Annual IC Time Burden (Hours)
1,152
0
1,152
0
0
0
Annual IC Cost Burden (Dollars)
0
0
0
0
0
0
Documents for IC
Title
Document
Date Uploaded
Blank fields in records indicate information that was not collected or not collected electronically prior to July 2006.